2085 Zanker Road
San Jose, CA 95131
You Are Here: Assembly » BGA Assembly Defects » Cracked Balls

Cracked Balls

Due to mechanical stress prior, during, and after reflow, BGA balls can incur fractures or cracks leading to board defects, either immediate or latent resulting from an intermittent connection. When a ball has a crack, it can develop into a fracture due to greater stresses. A ball fracture separates the electrical contact between the board and BGA. An accurate reflow prevents these defects.

Contact Us Today!

To speak to a BGA specialist, please call us at 1.866.845.1197 or email us at info@bga.net.

In This Section