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In effect, this is a soldering defect that plagues BGAs, CSPs, and package-on-package (PoP) on the assembly floor and is caused by either the incomplete wetting of a solder joint or component warpage. Like the name indicates, visually, this defect shows the BGA ball and PCB pad solder deposit not solidly connecting, thus appearing as a head resting on a pillow.

BGA Assembly Defects- Head On Pillow

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