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Open Solder

Creates a defect when there’s a lack of solder at a BGA’s ball or there’s solder only on the BGA pad, but not on the ball. This can create intermittent connections. There are varying causes of open solder with the most prevalent ones being an absence of solder paste or paste deposit or improper release inconsistencies, poor stencil design, a gap exists between a BGA ball and a PCB pad, contamination on a ball, among other causes.

BGA Assembly Defects- Open Solder

BGA Assembly Defects - Detach from Surface

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