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Plastic packages for most ICs and other components offer advantages like low cost, size, and weight. However, moisture inside a device like a plastic BGA packaged µP or FPGA gets heated up very quickly during rework and a tiny explosion or rupture takes place. Consequently, this induced stress causes the package to crack as well as creates de-lamination between mold compound and lead frame or chip inside the package. This phenomenon is called the “popcorn effect.”

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