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Advantages of Using Filled Vias

  • Using filled vias along with via-in-Pad, provides a more efficient use of the PCB space for routing, copper and components and hence help in miniaturization of the product.
  • Filled vias allow the fan-out of fine pitch BGA devices without violating copper clearances.
  • They are a great way to minimize impedance mismatches on high speed signals.
  • They provide a low inductance path through the decoupling capacitors by enabling the placement of decoupling caps directly on the opposite sides of the BGA. Issues like ground bounce, Vcc Sag and switching noise are greatly reduced.
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