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Disadvantages of Using Filled Vias

  • Via-in-Pad along with any kind of fill is a specialized process and can extend the PCB fabrication time by 3-5 days. It is also more expensive.
  • Using this technology limits the OEMs options as far as choosing the fabrication vendor. Choosing the right fab-house is of utmost importance. Via fill, if not done properly could result in issues like:
    • Out-gassing
    • Voids in Pads
    • BGA pads that do not offer a flat surface
    • Black-Pad.


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