BGA packages come in a variety of pitches and sizes. As device complexity and OEMs drive increasingly use smaller components, ball pitches of 0.5, 0.3, and 0.25 millimeter (mm) and lower are becoming more popular. The number of layers required for effectively routing these packages is dictated by the layout of balls in each package. If several other technologies and components are already designed on the board, system cost is factored with every added board layer. The intent of the board designer is to optimize the number of layers required to route these packages, considering both cost and performance. The following provides you board level routing guidelines when using high pin count and fine pitch BGAs. Different routing strategies are discussed including fan-outs, using several BGA pitch sizes.