2085 Zanker Road
San Jose, CA 95131
You Are Here: Design » Specialized Techniques for Escape Routing

Specialized Techniques for Escape Routing

When using fine pitch BGAs, vias on pad technique may be implemented. The vias are placed directly on the BGA pads and filled with a conductive material, usually silver, which can provide a fairly flat surface. In some instances, the only option is to use silver-filled vias.  They are less expensive to fabricate compared to blind and buried vias, hence, in some cases, compromises must be made between cost and manufacturing time. 

In a BGA pad design, using silver-filled vias, the need for dog-bone fan-out (see image below) is eliminated, and a small increase in density is realized by being able to route a few more signals on the outer surface. In addition, discrete decoupling capacitors can be placed directly over the vias on the bottom side, providing a low inductance path to the power system.

Contact Us Today!

To speak to a BGA specialist, please call us at 1.866.845.1197 or email us at info@bga.net.

In This Section